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Chinese company to roll out 5G chips on 7nm geometry


Friday, August 23, 2019

Unisoc Communications, Tsinghua Unigroup's chipmaking arm, has had its 7nm 5G baseband chip proceed to the customer validation stage, according to a media report from China.

Unisoc is aiming to release its 7nm baseband solution designed for 5G smartphones in 2020, according to 36Kr.

Unisoc also plans to roll out its 5G SoC chip in early 2020, the sources continued. In order to step up its 5G chip market deployments, Unisoc has recently hired a number of senior staff from Huawei's HiSilicon to enhance its product development and marketing strategy aiming to be among the leading China-based chipmakers, the report indicated.

In fact, Unisoc CEO Steve Chu was previously chief strategy officer of HiSilicon and VP of strategy and technology of Huawei. Chu has already made major changes to Unisoc's organizational structure and business development strategy, the report noted.

Unisoc unveiled its first-generation 5G baseband earlier in 2019. Dubbed Ivy 510, the chip is manufactured using TSMC's 12nm process technology and will serve as the company's crucial offering in the transition to 5G.

Unisoc CTO Qiu Xiaoxin was quoted as saying in previous reports that the company will focus on 7nm production of 5G chips in 2020.

By: DocMemory
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