Yangtze Memory Technology (YMTC) started producing 256Gb TLC chips using its in-house developed 64-layer 3D NAND technology in the first quarter of 2019, with monthly output reaching 5,000 wafers initially. The China-based memory startup has since then ramping up the chip output without disclosing numbers.

Speculation has circulated in China's chipmaking industry that YMTC plans to increase its 64-layer 3D NAND chip output to 60,000 wafers monthly by the end of 2020. In response, YMTC VP and co-CTO Weihua Cheng said the company would not disclose any specific plans or figures for the time being.

Cheng also declined to disclose YMTC's progress in its 128-layer 3D NAND development. The company reportedly will move directly to the 128-layer generation with volume production set to kick off as early as 2020.

In addition, YMTC has plans to roll out the second generation of its in-house developed Xtacking chip architecture designed for server and datacenter applications as well as just PCs and mobile devices, according to industry sources.

In other news, Cheng attended a technology forum held by China Integrated Circuit (CIC) recently discussing the emerging memory technologies including magnetoresistive RAM (MRAM) and phase-change RAM (PRAM), which will deliver higher performance and lower costs than the current mainstream technologies.

By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved