Wednesday, January 22, 2020
Yangtze Memory Technology (YMTC) is ramping up its chip output for applications requiring embedded storage and SSD solutions in 2020, and has built partnerships with companies including flash device controller suppliers and memory module makers, according to the China-based NAND chipmaker.
YMTC's ecosystem partners include Marvell, China's Longsys Electronics, Goke Microelectronics, Maxio Technology and Unionmemory Information System, and Taiwan-based Adata Technology, Phison Electronics and Silicon Motion Technology.
YMTC, in which China's state-owned Tsinghua Unigroup holds a controlling stake, is bracing for robust memory demand for the emerging 5G, AI, big data, IoT and cloud computing applications this year, said Tsinghua Unigroup chairman and CEO Zhao Weiguo. The memory market is poised for exponential growth in 2020, according to Zhao.
YMTC introduced in October 2017 its in-house developed Xtacking chip architecture for the manufacture of 3D NAND flash memory, and kicked off volume production of 64-layer 3D TLC NAND chips starting September 2019. The company is looking to move directly to the 128-layer generation this year, eyeing strong demand for high-capacity and high-density storage products.
YMTC has R&D centers in Wuhan, Shanghai and Beijing, with R&D workforce reaching about 2,000 engineers.
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