The Wafer Level Packaging (WLP) market is forecast to be worth over $5 billion by 2023, according to Yole Developpement.

Wafer Level Chip Scale Packaging (WLCSP) remains a mainstream and cost-effective form factor, while the Fan-Out (FO);package market is expected to reach more than $2 billion by 2025. Fan-out finds increased heterogenous applications such as Apple APU7 package on InFO-PoP and upcoming InFO-AiP devices.

WLCSP revenue slightly increased in 2019 due to the new generation of smartphones & to the wearable/IoT ecosystem.

“The number of WLCSP packages exceeded 29 billion units in 2019 and many players continue to add capacity and capability in key geographies”, says Yole’s Vaibhav Trivedi.

The WLCSP market drivers area PMICs8, audio-Codecs and connectivity modules.

5G, and IoT remain drivers as WLCSP package count is expected to increase to support high bandwidth applications.

In parallel, the Deca M-Series continues to gain momentum in “fan-in” form as Qualcomm starts adoption with growing need for package side protection and enhanced board reliability.

Finally, WLCSP packages will play a critical role in RF package eco-system as many wire bond parts are expected to be converted to flip chip form factors driving additional growth.

FO packaging continues to be adopted in high-density applications and high-performance computing, while WLCSP package becomes the mainstream “work horse” for smartphone & consumer applications.

FO packaging began several years ago with limited application, but it has now found a critical role and rightful place in the high-end packaging sector as a mature, reliable package technology.

“The number of WLCSP packages exceeded 29 billion units in 2019 and many players continue to add capacity and capability in key geographies”, says Yole’s Vaibhav Trivedi.

The WLCSP market drivers area PMICs8, audio-Codecs and connectivity modules.

5G, and IoT remain drivers as WLCSP package count is expected to increase to support high bandwidth applications.

In parallel, the Deca M-Series continues to gain momentum in “fan-in” form as Qualcomm starts adoption with growing need for package side protection and enhanced board reliability.

Finally, WLCSP packages will play a critical role in RF package eco-system as many wire bond parts are expected to be converted to flip chip form factors driving additional growth.

FO packaging continues to be adopted in high-density applications and high-performance computing, while WLCSP package becomes the mainstream “work horse” for smartphone & consumer applications.

FO packaging began several years ago with limited application, but it has now found a critical role and rightful place in the high-end packaging sector as a mature, reliable package technology.

By: DocMemory
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