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Macronix to ship 3D NAND this year


Monday, May 11, 2020

Macronix International is gearing up to ship its in-house developed 3D NAND memory starting the second half of 2020, according to company chairman Miin Wu.

Macronix has developed 96-layer 3D NAND flash memory, said Wu, adding that sales of its 3D NAND chips will be insignificant as a proportion of company revenue this year, but the sales proportion is expected to grow substantially in the second half of 2021, Wu indicated.

Macronix is also in the development of 192-layer 3D NAND flash, Wu continued, with volume production slated to kick off in 2022.

Macronix' 3D NAND flash memory will be targeted at niche-market applications in the short term to avoid direct competition with international memory vendors, Wu noted.

In addition, Macronix has kicked off volume production of 19nm SLC NAND flash chips since the second half of 2019. With its 19nm SLC NAND chips, Macronix has expanded its target markets to include not only set-top boxes (STB) and other consumer electronics products but also automotive electronics applications.

Macronix reported revenues of NT$3.43 billion (US$114.6 million) for April 2020, down 11.7% on month but up 64.4% on year. Revenues for the first four months of 2020 totaled NT$12.84 billion, rising 58.3% from a year earlier.

By: DocMemory
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