Synopsys' Fusion Design Platform has enabled Samsung Foundry to achieve first-pass silicon success for an advanced, high-performance and multi-subsystem SoC, validating the extended PPA benefits of its next-generation 3nm gate-all-around (GAA) process technology, according to the EDA company.

This tapeout is the culmination of an extensive collaboration between Synopsys and Samsung Foundry to accelerate the delivery of a highly optimized reference methodology that realizes the maximum power and performance opportunities inherent to the latest 3D transistor architecture, said Synopsys.

The reference flow from Synopsys deploys the full breadth of Synopsys' highly integrated fusion design platform, including the industry's only integrated and golden-signoff-enabled RTL-to-GDSII design flow coupled with the most trusted, golden-signoff products, the company claimed. Customers targeting Samsung Foundry's latest 3nm GAA process can realize the maximum PPA entitlement for next-generation designs spanning HPC, 5G, mobile and advanced AI applications.

"Our latest, advanced 3nm GAA process has benefited from our extensive collaboration with Synopsys, and the accelerated readiness of the Fusion Design Platform to enable the efficient realization of the 3nm process' promise, is a testament to the importance and benefit of these key alliances," said Sangyun Kim, VP of Samsung's foundry design technology team, in a statement issued by Synopsys.

"The GAA transistor structure marks a key inflection point in process-technology advancement that is critical in maintaining the scaling trajectories needed for the next wave of hyperscale innovation," said Shankar Krishnamoorthy, GM of Synopsys' digital design group. "Our strategic collaborations with Samsung Foundry in support of the co-delivery of best-in-class technologies and solutions are ensuring the continuation of these scaling trends and the associated opportunities these offer to the broader semiconductor industry."

By: DocMemory
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