AKHAN Semiconductor has manufactured 300mm complementary metal-oxide-semiconductor (CMOS) diamond wafers. An industry breakthrough, 300mm CMOS diamond wafers will enhance power handling, heat management and durability of electronics across industries with little change to fabricators’ existing manufacturing processes.

Due to its inherent properties, diamond is proven to be the most optimal semiconductor material, far outmatching the capabilities of silicon, the industry-standard material for more than six decades. To produce the world’s most advanced technologies, semiconductor fabricators traditionally rely on 300mm silicon wafers despite the fact that silicon has reached its physical limitations. As the global industry advances beyond Moore’s Law, the ability to produce 300mm diamond wafers is crucial to semiconductor fabricators, especially in advanced industries like aerospace, telecommunications, military and defense, and consumer electronics.

“The semiconductor chip shortage has been well documented this year,” said Tom Lacey, AKHAN’s Chairman of the Board. “As the U.S. plans to increase chip supply, it is also important to fabricate using the best materials available to enable the best performance.”

“AKHAN’s 300mm diamond wafer is the foundational building block that will lead to more powerful and durable devices that run cooler, and fabricators only need to make minor updates to their existing manufacturing processes,” said Adam Khan, Founder of AKHAN Semiconductor. “From weapon systems to spacecraft, the world’s most sophisticated devices and technologies stand to benefit exponentially from diamond. Now that we’ve proven the ability to manufacture this ideal material on 300mm wafers, fabricators will have access to the most optimal chip material so that their end products perform far more efficiently.”

As the United States assesses the semiconductor supply chain in light of the current global shortage and works to recapture its leadership position within this critical space, policymakers must prioritize the companies that are moving beyond silicon by innovating and developing next generation chips with materials like diamond. Beyond diamond’s advanced capabilities, U.S. adversaries understand how powerful this coveted jewel can be and are prioritizing the development of the material for advanced weapons usage.

By: DocMemory
Copyright © 2023 CST, Inc. All Rights Reserved