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Kyocera to build $500M IC packaging factory


Monday, May 9, 2022

Kyocera has announced a plan to build a $500m manufacturing facility, the largest it has ever operated in Japan, expanding production capacity for components including organic semiconductor packages and crystal device packages.

Construction is scheduled to begin next month at the company’s Sendai Plant Campus in Kagoshima.

Three converging factors are creating strong demand for Kyocera’s organic semiconductor packages and crystal device packages. Smart vehicles are expanding the need for automotive cameras and high-performance processors used in Advanced Driver-Assistance Systems (ADAS) and autonomous driving. New communications infrastructures, including fifth-generation (5G) base stations and datacentres, are being deployed worldwide.

In addition, the rising trend toward digitalisation is expanding demand for electronic products ranging from personal computers and smartphones to consumer goods, industrial automation, and others.

Kyocera will open the new facility in October 2023 to serve these growing trends, aiming for a 4.5-fold increase in production capacity for organic packages at the Sendai Plant Campus, as well as a substantial increase in capacity for crystal device packages.

By: DocMemory
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