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Winbond's secure flash is now SESIP Level 2


Friday, June 3, 2022

This is the first certification using GlobalPlatform SESIP Profile for Secure External Memories, and NIST 8259A (IoT device cybersecurity capability core baseline). The certification also claims compliance with IEC 62443 (security for industrial automation and control systems).

The W77Q family has also been certified with the Common Criteria EAL2+, Functional safety ISO26262 ASIL-C level and FIPS 140-3 CAVP.

W77Q Secure Flash comes in densities of 16Mb, 32Mb, 64Mb and 128Mb and operates at a frequency of 66MHz in Double Transfer Rate mode and 133MHz in Single Transfer Rate mode.

It features a standard single/dual/quad/QPI serial peripheral interface (SPI) and industry-standard packages and pin-outs to enable their uses as a drop-in replacement for non-secure SPI NOR Flash devices.

W77Q Secure Flash can retain data for over 20 years and perform 100,000 Programme/Erase cycles with a wide operating temperature range of -40°C to 105°C.

Complementary to the host chip, W77Q Secure Flash provides the security features of secure boot code storage and authentication, secure firmware update, remote attestation for building platform Root of Trust and firmware resiliency.

"In the world of connected devices, security is becoming strategic for risk management, market differentiator and compliance. Many standards and regulations are emerging across regions and verticals. Standards like IEC 62443, NIST 8259A and others are looking to address core security functionality. SESIP has rapidly grown internationally as the recognised certification going beyond the security fragmentation.

“As an optimised version of CC applied to IoT market, SESIP is providing evidence of secure products by design. The proper protection of stored data is a key element of the overall security of devices." said Carlos Serratos, Director of Strategy at SGS Brightsight.

By: DocMemory
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