Telink Semiconductor will be showcasing its cutting-edge IoT chip technology at the upcoming Nepcon Vietnam 2023 event, which is scheduled to take place from September 6–8 at the esteemed Hanoi International Exhibition Center, Vietnam.

Dedicated to the pioneering concept of “Inside Electronics 4.0,” Telink Semiconductor is unwavering in its commitment to offering the most advanced chip solutions to a global clientele. Its showcase at Nepcon Vietnam 2023 will highlight its stellar TLSR8 and TLSR9 series SoCs, exemplifying its industry-leading product range. These low-power, highly-integrated SoCs boast a myriad of rich interfaces, making them a cornerstone in various IoT applications, including smart homes, remote control, wireless audio, human interface devices, wearables, electronic shelf labels, location services, wireless gaming, health and wellness, and Bluetooth dual-mode multi-connection.

To facilitate an immersive understanding of cutting-edge IoT technology, the company will also feature a series of application demonstrations. Of particular note are its 3-in-1 Low-latency Wireless Gaming Demo and Bluetooth & UWB Module Demo, both of which will showcase Telink’s prowess in the development and application of the latest wireless technologies.

Nepcon Vietnam 2023 presents an exceptional opportunity for Telink to foster profound dialogues and collaborations with esteemed customers and visitors from around the globe. To know more about the trends and potential applications of IoT chip technology, visitors can connect with Telink at Booth No. X14.

By: DocMemory
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