TSMC said last week at its Technology Symposium that it will start high volume production on its N2 process using GAA transistors this year, and that production on its N2P process using both GAA and backside power delivery (BSD) – would start in 2026.

“We are offering our customers the most comprehensive set of technologies to realise their visions for AI – the world’s most advanced silicon,” said TSMC CEO, C.C. Wei.

Intel’s 18A process, which has both GAA and BSD is IMG_2950-150x150.jpegdue for production next year when it says it will regain industry process technology leadership.

“We expect to release the 1.0 PDK for Intel 18A this quarter,” said Intel CEO Pat Gelsinger at the company’s Q1 results meeting last week, “furthermore, our lead products, Clearwater Forest and Panther Lake are already in fab, and we expect to begin production ramp of Intel 18A in these products in the first half of ’25 for product release in the middle of next year.”

Sansung started producing GAA ICs on 3nm two years ago with various reports of problematic yields. It is not intending to use BSD until its 2nm process which was planned for production in February this year.

Samsung says it has a foundry contract for 2nm with ten year-old Japanese AI startup Preferred Networks (PFN).

By: DocMemory
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