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Winbond unveils 1Gb QspiNAND Flash for wearable and low-power IoT devices


Friday, August 9, 2024

This NAND solution has been designed to meet the demands of wearable and battery-operated IoT devices offering low standby power, a small-form-factor package, and continuous read for fast boot and instant-on support.

It provides high-speed read capabilities, achieving speeds up to 52MB/sec in both Continuous Read and Sequential Read modes, and its fast boot and instant-on support also help to enhance energy efficiency and extend the devices' operational lifespan.

The solution also offers an advanced deep power-down mode that reduces power consumption to as low as 1µA.

The W25N01KW is available in compact WSON8 (8mm x 6mm) and WSON8 (6mm x 5mm) packages. These features ensure ultra-fast code/data access, longer battery life, and compact design, contributing to an optimized user experience across various applications.

“The W25N01KW reflects our commitment to excellence, integrating innovative design elements to transform the landscape of wearable and low-power IoT devices, enabling manufacturers to deliver cutting-edge solutions to consumers,” said Winbond.

It is suitable for energy-efficient devices that require high performance in a compact design. In addition to wearable and low-power IoT applications, it’s also suited for use in smart cameras such as IP cameras, surveillance systems, battery-powered Wi-Fi cameras, and smart doorbells.

In response, Kuala Lumpur has implemented policies to boost its attractiveness, including $5.6 billion of incentives and the setting up of a chip-design hub near the capital. It is also trying to draw more investments in wafer production, the front-end manufacturing considered to be the most valuable part of the chipmaking process, from the likes of Infineon and others to upgrade its capabilities.

By: DocMemory
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