Nordic Semiconductor has launched a wafer-level chip scale package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent—making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.

The nRF7002 WLCSP supports advanced Wi-Fi 6 capabilities including OFDMA and Target Wake Time (TWT), providing robust and efficient wireless connectivity. The IC is optimized for ultra low power operation, ensuring longer battery life for connected devices. Its smaller form factor provides developers with a Wi-Fi solution suitable for space-constrained applications such as modules, wearables, and portable medical devices.

The nRF7002 Wi-Fi 6 companion IC seamlessly integrates with Nordic’s award-winning nRF91 Series Systems in Package (SiPs), nRF52 and nRF53 Series multiprotocol Systems-on-Chip (SoCs), and the upcoming nRF54L and nRF54H Series SoCs. This integration ensures developers can access the full potential of Wi-Fi 6—including higher data rates, increased capacity, and improved power efficiency—alongside Nordic’s best-in-class LTE-M/NB-IoT and Bluetooth LE solutions—simplifying development and accelerating time-to-market.

“We are excited to offer the nRF7002 in a WLCSP package. Adding the package to the nRF7002 family provides our customers with a versatile and compact solution that meets the growing demands for smaller, more power-efficient IoT devices. This new option underscores our commitment to Wi-Fi and to delivering innovative connectivity solutions that enable our customers to push the boundaries of what’s possible in wireless design,” said Joakim Ferm, SVP Wi-Fi BU, Nordic Semiconductor.

By: DocMemory
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