TSMC’s state-of-the-art 2nm semiconductor fab in Kaohsiung marked a key milestone today with its equipment installation ceremony, showcasing remarkable progress in advanced chip manufacturing. The project achieves three major milestones:

Expanding Taiwan’s 2nm Production

TSMC’s 2nm strategy is advancing on two fronts: the flagship Baoshan fab in Hsinchu and the Kaohsiung facility, both targeting mass production in 2025. The Baoshan plant led the way with equipment installation in April 2024, while Kaohsiung’s expansion underscores its growing importance in southern Taiwan’s semiconductor ecosystem.

Originally planned for mature technologies, the Kaohsiung fab pivoted to 2nm production after a strategic decision in August 2023. This shift accelerated its timeline by over six months, culminating in today’s ceremony.

Surging Demand for 2nm Chips

TSMC’s confidence in 2nm technology is reinforced by growing customer demand. Chairman C.C. Wei recently highlighted that inquiries for 2nm nodes have exceeded those for 3nm, with capacity expected to rise significantly.

Currently, southern Taiwan’s most advanced production hub lies in Tainan’s Science Park, where 3nm chips are produced. With Kaohsiung gearing up for 2nm production, it will establish itself as a leader in advanced chip manufacturing. To meet surging demand, Tainan’s facilities may also contribute to 2nm production, strengthening Taiwan’s do3nmminance in next-generation semiconductor technology.

By: DocMemory
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