Rapidus, the Japan government-backed 2nm startup, says it has started the prototyping process for 2nm GAA ICs at its Innovative Integration for Manufacturing (IIM-1) foundry.

IIM-1 uses a fully single-wafer front-end process in which adjustments can be made to a single wafer, inspected and if successful, applied to all subsequent wafers. Single wafer captures more data, enabling AI models to be trained to improve wafer production and increase yields.

IMG_0970-150x150.webpRapidus is one of the first companies that will commercialize fully single-wafer processing, which is central to its Rapid and Unified Manufacturing Service (RUMs).

On April 1, 2025, Rapidus completed EUV exposure, approximately three months after the EUV machine was delivered in December 2024.

Rapidus broke ground on IIM-1 in September 2023, completed the clean room in 2024 and hooked up equipment in June 2025.

It is developing a PDK compatible with IIM-1’s 2nm process and will release it to advance customers by Q1 2026, while preparing an environment in which customers can start their own prototypes.

Rapidus will begin mass-production in 2027 if it manages to raise another $19-25 billion which is the estimated funding gap between what Rapidus has already raised, and what it will require to get into mass production.

By: DocMemory
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