United Microelectronics Corporation (UMC) has introduced a new 55nm BCD platform — also known as 55nm BCD technology — designed to deliver higher performance and power efficiency for next-generation mobile, consumer, automotive, and industrial devices. The foundry’s latest process node helps designers manage growing power management complexity while reducing chip area and improving noise performance.

This launch highlights UMC’s push into advanced specialty technologies that could directly impact power IC design, mixed-signal integration, and system efficiency across a wide range of electronics markets.

Expanding the power management toolbox

BCD technology enables analog, digital, and power circuits to coexist on a single die — a key requirement in power management and mixed-signal ICs. UMC’s new 55nm BCD platform extends that flexibility with three main process variants tailored to different application needs.

The Non-Epitaxy (Non-EPI) process offers a cost-effective approach focused on power efficiency and analog performance for consumer and mobile devices. For automotive applications, UMC’s Epitaxy (EPI) process supports operating voltages up to 150V and meets the stringent AEC-Q100 Grade 0 automotive standard, ensuring reliability in extreme operating environments. Meanwhile, the Silicon-on-Insulator (SOI) process targets high-grade automotive and industrial systems, offering AEC-Q100 Grade 1 compliance, superior noise suppression, and low leakage performance.

The platform also supports ultra-thick metal (UTM), embedded flash, and resistive RAM (RRAM) options, giving designers more flexibility in integrating memory and high-current paths for power applications.

Strengthening UMC’s specialty portfolio

“The readiness of our 55nm BCD platform marks a major milestone for UMC, rounding out our specialty BCD technology portfolio and boosting our competitiveness in the power management market,” said Steven Hsu, Vice President of Technology Development at UMC. “While 55nm BCD has been in production for several years in the market, UMC provides brand-new comprehensive 55nm BCD solutions with competitive device performance, enabling our customers to build innovative power solutions for everything from smartphones and wearables, to automotive, smart homes and factories.”

With this launch, UMC now offers one of the broadest BCD process portfolios in the industry — spanning from 0.35µm down to 55nm — covering voltage ranges suitable for diverse markets. The foundry’s combination of extensive IP, design enablement, and process maturity positions it to support the evolving demands of power electronics and mixed-signal IC manufacturers looking to push efficiency and integration further.

For Europe’s design community, where efficiency, reliability, and integration remain central to innovation, UMC’s 55nm BCD platform offers a timely upgrade path for the next generation of automotive and industrial power solutions.

By: DocMemory
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