Monday, November 10, 2025
The Taiwan chip giant has been evolving at a rapid pace in terms of technological innovation. Although it is still in the 3nm node timeline, the firm has already initiated work on the advanced 1.4nm node, indicating its commitment to the industry. According to a report by the Taiwan Economic Daily, TSMC has begun construction of the 1.4nm facility in the central Taiwan city of Taichung. The project is estimated to cost $48.5 billion, with production expected to commence by 2028.
Interestingly, the fab being discussed here was initially intended to be a 2nm facility, but TSMC revised its plans, bumping up the production to an Angstrom-era level. The reason behind this move is that the Taiwan giant intends to populate a significant portion of its 2nm production lines in the US, given the massive demand the firm sees from HPC and mobile customers. Essentially, TSMC plans to retain cutting-edge technology production in Taiwan while increasing the capacity of older nodes in overseas facilities to meet the requirements of its clients.
Rapidus semiconductor facility in Japan aiming for 2nm chip mass production by 2027 amid competition from TSMC and Samsung
The 1.4m facility will house four different fabs, with the first one coming online by the end of 2027, with initial mass production numbers claimed to be around 50,000 wafers. The A14 node is going to be an interesting one from the Taiwan giant, considering that it wouldn't adopt High-NA EUV lithography, instead focusing on complex multi-patterning techniques. Competitors like Intel's 14A will employ the advanced lithography technique, so it's intriguing to see TSMC's stance on this matter. Nonetheless, we know that the giant of Taiwan is fond of excelling with its nodes.
The demand for the A14 node will primarily be driven by Apple, Qualcomm, and MediaTek, as well as mobile customers. However, HPC clients such as NVIDIA and AMD will also play a key role, utilizing the node for their next-generation AI architectures.
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