Yangtze Memory Technologies Corp (YMTC) has broken ground on its third NAND fab in Wuhan and plans to run first silicon in 2027, reports the Nikkei.

The company is also expanding its second fab and considering entering the DRAM market, say reports.

Two years ago YMTC unveiled a 232-layer 3D NAND memory – the X3-9070 – with QLC, 200+ active word lines and a bit density of 19.8 Gb/mm².

This chip was developed using YMTC’s Xtacking 3.0 architecture and is part of YMTC’s Wudangshan project which aims to rely on Chinese equipment for production.

YMTC is estimated by Omdia to account for 20% of worldwide investment in NAND this year. years. It currently has about 7-8% of global production capacity but under 5% of global NAND revenue.

YMTC breaks ground on third fab

The intention is to expand its share of global production capacity to 10%+ and challenge Micron for fourth place in the NAND market.

Although hit by US restrictions on buying advanced manufacturing equipment, YMTC is installing more locally made equipment than in its previous fabs.

By: DocMemory
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