HBM4 is known as a 'revolutionary' offering from memory giants, thanks to the innovations it brings to the module. We'll discuss HBM4 in detail ahead, but Samsung has actually managed to 'turn the tables' with its HBM business, as the company was struggling to acquire customers a few quarters ago and even faced rejection from NVIDIA. However, according to recent reports from Korean media, Samsung's HBM4 modules are now the first in line for adoption by NVIDIA for its Vera Rubin AI lineup, with supply expected as soon as next month.

There are several reasons why Samsung's HBM4 process stands out from the rest, but one of the biggest differentiators is the Korean giant's offer of the highest pin speeds. Samsung's HBM4 is rated at 11 Gbps+, which is much higher than the JEDEC standard, mainly because it was a key requirement from NVIDIA. With agentic AI being the next big avenue, Vera Rubin has seen a massive upgrade in memory specifications, and this is mainly driven by the integration of Samsung's HBM4 modules, which feature superior speeds and interface width.

Another interesting point with Samsung's HBM4 is that the firm employs a logic base die (4nm) that is sourced from the company's internal foundry, and this gives them the room to guarantee NVIDIA supply with adequate delivery timings, relative to SK hynix and Micron, which plans to source their logic dies from TSMC. Considering how quickly NVIDIA has brought in Vera Rubin into "full production", it is important for suppliers to keep up the pace, and Samsung has apparently done just that.

It is diclosed that customer shipments around Vera Rubin start from August, and that Rubin AI chips will be displayed entirely at GTC 2026, where Samsung's HBM4 module will also see the spotlight.

By: DocMemory
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