Friday, January 30, 2026
The new devices are based on KIOXIA’s eighth-generation BiCS FLASH 3D memory and are designed to meet growing demand for larger storage in mobile and connected products. By storing four bits per cell, QLC UFS offers higher bit density than traditional triple-level cell (TLC) solutions, enabling greater capacity within a compact footprint.
According to KIOXIA, advances in controller design and error-correction technology have allowed QLC memory to deliver competitive performance alongside higher density. Compared with the company’s previous generation QLC UFS devices based on UFS 4.0 and BiCS6 technology, the new UFS 4.1 products provide a 25% increase in sequential write speeds, a 90% improvement in random read performance and a 95% gain in random write speeds. Write Amplification Factor (WAF) is also reduced by up to 3.5 times when WriteBooster is disabled.
The QLC UFS 4.1 devices are primarily aimed at smartphones and tablets, but KIOXIA says they are also suited to emerging applications that require higher capacity and performance, including personal computers, networking equipment, augmented and virtual reality systems, Internet of Things devices and AI-enabled products.
The memory is available in 512GB and 1TB capacities and integrates both flash memory and controller into a JEDEC-standard package. KIOXIA’s eighth-generation BiCS FLASH introduces CMOS directly Bonded to Array (CBA) technology, an architectural change intended to improve performance and efficiency in flash memory design.
Additional features include compliance with the UFS 4.1 specification, with backward compatibility for UFS 4.0 and UFS 3.1, support for WriteBooster to accelerate write operations, and a reduced package size of 9 × 13 mm, down from 11 × 13 mm in the previous QLC UFS generation.
“KIOXIA continues to advance flash memory technology to meet the growing demand for higher-capacity, high-performance storage,” said Maitry Dholakia, vice president of the Memory Business Unit at KIOXIA America. “Our QLC UFS 4.1 devices reflect ongoing innovation in both architecture and design, enabling our customers to build increasingly capable mobile and connected
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