As TSMC struggles to keep up with demand for its 2nm process, DigiTimes reports that the world’s largest semiconductor manufacturer has an extensive roadmap highlighting its current-generation and bleeding-edge lithographies. While pursuing 2nm production is just the start, the company also intends to begin mass production of its 1.4nm process, known as A14, in 2028, promising up to a 30 percent improvement in both performance and power efficiency.

The firm also has plans to fulfill orders for clients wanting to use the A16, or 1.6nm node, but a time will come when TSMC will be met with a mountain-sized challenge, which is manufacturing wafers on the sub-1nm lithography. The report doesn’t identify any potential customers for the super-advanced process, but Apple is highly likely to be an early adopter, which is probably why TSMC is said to commence trial production by 2029.

The firm’s Tainan A10 facility, along with TSMC’s P1-P4 plants, will be utilized to transform this dream into a reality, with an initial monthly wafer target of 5,000 units. Demand for AI chips has certainly overwhelmed TSMC, which is why it is making adjustments to meet orders as early as possible. However, demand for iPhones is equally high, so we shouldn’t be surprised if Apple has to fork over a premium to obtain the initial batches as it has done on previous occasions.

Then again, the Cupertino titan has a long way to go before its sub-1nm SoC officially enters mass production, and that too if TSMC can address those yields. Due to this very problem, a rumor is circulating, claiming that smartphone makers are being forced to introduce chipset downgrades for their flagship releases, choosing to reserve those SoCs for the ‘Ultra’ range of devices.

By: DocMemory
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