Tuesday, December 17, 2002
SanDisk Corp. today said that a 300mm wafer fab upgrade and expansion for flash memory might be taken place in the near future for its 50-50 FlashVision Japan venture with Toshiba Corp.
Currently, the fab is making 200mm NAND wafers for Toshiba and SanDisk, as well as other non-NAND memory wafers for Toshiba. Toshiba and SanDisk plan to substantially increase Yokkaichi's 200mm NAND wafer output in 2003 and 2004 on the existing NAND production line, SanDisk said.
The company continued to say that the projected increased market demand for flash storage in 2005 and 2006 may outstrip the maximum capacity of 200mm NAND wafers available from the Yokkaichi fab. Therefore, the two companies are likely to add a 300mm wafer fab starting 2006 to support the increase demand.
SanDisk said it would most likely have to seek additional sources of financing for this investment.
By: DocMemory
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