Thursday, December 19, 2002
UMC and Xilinx, Inc announced that they are on track to produce a new family of programmable chips in the second half of 2003, using UMC's 90 nanometer (nm) chip-making process technology.
UMC is preparing to manufacture the line of Xilinx field programmable gate arrays (FPGA) at its 300mm fabrication facility and has produced an FPGA test chip.
At 90nm, engineers can pack more transistors, layers, interconnect and product features into a single chip, reducing die size by 50 to 80%, compared to any competing FPGA solution. UMC's L90 process integrates nine layers of high-speed copper interconnect, 1.2V high performance transistors and low-k dielectric material into a single manufacturing process.
Investment in 90nm manufacturing technology will enable the company to drive pricing down to under US$25 for a one-million-gate FPGA (approximately 17,000 logic cells), which represents a savings of 35 to 70% compared to any competitive offering, according to Xilinx.
John Hsuan, vice chairman and CEO of UMC, said, "Xilinx stands to gain the maximum cost advantages of manufacturing products on 300mm wafers using 90nm process technology, due to fundamental device architecture and die size of its FPGAs. We're looking forward to helping Xilinx bring to its customers the full benefits of this advanced manufacturing."
By: Docmemory
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