Tuesday, December 24, 2002
Micron Technology has demonstrated 1Gbit DDR SDRAM components manufactured on 0.11-micron process technology, the company said today.
Micron's 2.5V gigabit DDR SDRAM components are packaged in a standard 400mil thin small outline package (TSOP). Designed for high-bandwidth and low latency while increasing the memory density needed for future high-end desktop, server and mainframe applications, initially, the 1Gbit DDR SDRAM will be used in 4Gbyte registered DIMM modules in servers.
"Manufacturing these components on Micron's 0.11-micron process technology makes them highly competitive in terms of cost and performance," said Terry Lee, executive director of advanced technology and strategic marketing for Micron's computing and consumer group, in a statement.
"The use of this advanced process technology delivers a smaller die size, which has enabled us to develop higher density DIMM modules. We will also apply 0.11-micron process technology to the high-volume products of today."
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