Tuesday, January 21, 2003
Advanced Micro Devices Inc. pulled out of AMD-Infineon-UMC technology development agreement and switched its allegiance to IBM Microelectronics earlier this month and Infineon said they will maintain business relationship with United Microelectronics Corp. (UMC).
Last year, AMD and UMC entered an agreement to build a 50:50 joint-venture 300-mm wafer fab called Au Pte Ltd. in Singapore. AMD's departure will have no significant impact on the progress of the Infineon-UMC development partnership," said a spokesperson for Infineon based in Munich.
Infineon and UMC did announce the intention to develop logic processes at the 65-nanometer and 45-nanometer nodes last year. But Infineon and UMC's interest is in low power for system-on-chip applications, whereas AMD's interest was in high-speed transistors and the use of SOI for performance.
But UMC is still a potential partner for Advanced Micro Devices Inc. in building a 300-mm wafer fab, according to AMD chief executive Hector Ruiz. AMD is considering a range of options for selecting a partner for building a 300-mm production fab, "We have not done an official disengagement with UMC (on the Singapore 300-mm fab) because they are still a very strong technology company. We want to maintain our options," Ruiz said. AMD might decide on a partner and location for its 300-mm production fab within the next several months.
By: DocMemory
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