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TI sales strong on new DSP for 2.5G
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Friday, January 24, 2003
Despite a seasonal dip that dropped revenue sequentially, Texas Instruments Inc. on Wednesday reported improved semiconductor revenues, particularly within its DSP and wireless businesses.
Additionally, the company announced it has shipped its first chip made using a 90nm manufacturing process, a digital baseband device for the 2.5G cellular handset market.
For the year, TI reported a loss of $344 million on revenue of $8.4 billion, compared to a loss of $582 million on revenue of $8.2 billion in 2001.
For the fourth quarter of 2002, TI reported a loss of $589 million on revenue of $2.1 billion, compared to net income of $188 million on revenue of $2.2 billion in the third quarter, and a loss of $116 million on revenue of $1.8 billion in the fourth quarter of 2001.
In the fourth quarter, TI had a $638 million write down associated with its ownership of Micron Technology Inc. stock received in the sale of TI's memory business to Micron in 1998.
In pro forma reporting, TI had net income of $100 million in the fourth quarter, and $387 million for the year. Pro forma results exclude amortization of acquisition-related costs, and other special charges.
In the fourth quarter, TI's DSP revenue grew 33% compared to a year ago, and analog revenue grew 30%. Both areas benefited from a 57% growth in wireless revenue, the company said.
Total revenue in the quarter decreased 5% sequentially due to a seasonal decline in calculator sales following its peak back-to-school sales in the third quarter, the company said.
"TI's DSP revenue grew 30% for the year, more than twice as fast as the DSP market overall," said Tom Engibous, chairman, president, and chief executive of TI in a statement. "This reflects our focus on markets with the best growth opportunities, and the ability of TI's signal processing solutions to address those opportunities."
TI said its now producing a limited number of digital baseband devices using a 90nm process at its Kilby R&D fab here. The first chips were custom devices for an undisclosed customer, and the company plans to ramp production of 90nm-based devices throughout the year.
The smaller geometry devices shrink overall transistor size, reduce power consumption, size, and manufacturing costs relative to the previous 0.13-micron process, said Hans Stork, senior vice president of TI's silicon technology development.
By: DocMemory
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