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Samsung develop industry first Multichip package


Tuesday, February 4, 2003 Samsung Electronics today introduced the industry's first multichip package that includes NAND flash along with an ARM-based processor and SDRAM memory.

Called a "System-in-Package", it is designed to have a low form factor and to reduce component count in handheld devices.

The multichip package includes a 203MHz ARM920T processor, a 256Mbit NAND flash and 256Mbit SDRAM. The package size is 17-mm by 17-mm and 1.4-mm in height.

The ARM processor includes a USB port to allow connections to many peripherals, such as printers, removable storage, and other handhelds. Samsung said the multichip package will also support the upcoming SDIO protocol

By: DocMemory
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