Tuesday, February 18, 2003
Advanced Micro Devices Inc. and Advanced Semiconductor Engineering Inc. (ASE) have signed a deal to jointly develop technologies for flip-chip assembly on organic packages for microprocessor chipsets, the companied announced today.
AMD and ASE will share technical expertise and exchange development information on flip-chip assembly materials, processes and equipment to assemble AMD's next-generation chipset products.
"AMD's collaboration with ASE will provide our customers with the latest chipset performance and signal integrity technology advancements, resulting in better overall system performance," said an executive of AMD. "Our new manufacturing capabilities will provide AMD chipset partners access to the latest production processes for high quality flip-chip assembly and packaging."
By: DocMemory
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