Friday, February 21, 2003
Intel said it plans to offer a wide range of stacked-die modules combining flash with SRAM or DRAM as standard products.
The rising demand for stacked chip-scale packages particularly in the cell phone handsets is driven by the increasing memory requirements with increasing features such as color screens, support for data services, elaborate ring tones and digital cameras.
Intel said stacked memory modules have been primarily a custom business tailored to each customer's requirementsts. The company's plans to standardize the stacked part will fuel more sales.
By: DocMemory
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