Monday, March 3, 2003
Hynix Semiconductor plans to open a 300mm-wafer pilot line in the fourth quarter of this year.
Farhad Tabrizi, Hynix vice president of marketing, said the Hynix will equip a fab shell in Chongju for the new 300mm wafer operation.
He said the 300mm fab will begin production using 100-nanometer (0.1-micron) process technology. The first chips in the new fab will be 512 Megabit DDR memory, and in Q2 '04 production will expand to 1 Gigabyte DDR, the Hynix official added.
Hynix will start 1Gbyte production earlier in an existing 200mm fab, planning samples in Q3 '03 and production in Q4 '03.
By: DocMemory
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