Tuesday, March 11, 2003
The cost to build a leading-edge fab has jumped to 4 billion today, according to analysts and chip makers at a conference.
The total cost for a 300-mm, 0.13-micron wafer fab was around $2-to-$3 billion each. Now, the cost for a next generatioin 300-mm, 90-nm (0.09-micron) plant is approximately $4 billion, said Joe Osha, principal semiconductor analyst for Merrill-Lynch.
The analysts said the enormous cost will be a barrier for companies to build factories. For that reason, foundries and their customers must form close collaborative partnerships.
By: DocMemory
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