Wednesday, March 19, 2003
NexFlash Technology Inc. today announced it has signed a foundry agreement with Taiwan's Winbond Electronics Corp. to design and produce flash memory products on Winbond's 0.18-micron WinStack process.
NexFlash, which is partially owned by Winbond and has a memory partnership in place with Sharp Corp., will introduce a new line of serial flash memories in the second half of the year to be manufactured at Winbond's fab.
"We are extremely pleased to have Winbond Electronics Corporation as our new foundry partner," said Thomas Liao, NexFlash's president and CEO, in a statement. "Winbond's state-of-the-art manufacturing facilities enable NexFlash to mass-produce cost-effective and high-quality serial flash products."
Holding out on its product details, the San Jose-based company claimed that serial flash memories are becoming a popular alternative to parallel flash as a means to reduce ASIC and controller pin count, system board space, power, noise and overall cost. While NexFlash continued to say that serial flash is well suited for code-download applications including graphics cards, DVDs, WLANs, ADSL and networking, it did not say what would make its expected memory superior to its competitors' memories.
Winbond, meanwhile, also has a foundry deal in place with memory giant Infineon Technologies AG. Through the agreement inked a year ago, Infineon licenses its DRAM trench technology to Winbond and in return gains exclusive access to standard DRAM chips manufactured using this technology.
By: DocMemory
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