Wednesday, March 19, 2003
Semiconductor Manufacturing International Corp., one of China’s two native foundries, is building a 0.13-micron fab outside of Beijing that sources say could produce 300mm wafers.
The hurdle for using 300mm technology isn’t technology-based, sources say. The real problem has to do with export controls from the United States. Sources say the company currently is heavily lobbying the U.S. government to ease those controls.
The foundry is expected to be churning out wafers within two years.
China until now has been one or more generations behind competing foundries in Taiwan, but a 300mm wafer plant would put it on par with state-of-the-art chip manufacturing.
SMIC did not return calls to its Fremont, Calif., office, and a spokesperson in Shanghai said no information was available about the new fab.
By: DocMemory
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