Thursday, March 27, 2003
Infineon Technologies announced that it would transfer 0.11-micron DRAM trench technology and 300-mm wafer production know-how to Shanghai's Semiconductor Manufacturing International Corporation (SMIC).
The deal gives substance to the hints that SMIC has been dropping about moving quickly to 300-mm. Earlier this week, SMIC chief executive Richard Chang suggested that by year's end his company might move 300-mm wafer manufacturing equipment in to a fab being built in Beijing. It would mark a major milestone in China's quest to catch up with the rest of the globe in semiconductor manufacturing prowess.
A spokesperson at SMIC said the company would finish the fab shell by December and start purchasing equipment around that time. She declined to offer details on who would provide the advanced wafer processing equipment.
A spokesperson at Infineon said his company expected equipment to already be in the Beijing facility by, “early 2004”. Pilot runs would commence at mid-year and volume production start by the end of 2004 or early 2005. Training of SMIC personnel would start sometime this fall, the Infineon spokesperson said.
By: Docmemory
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