Friday, March 28, 2003
Grace Semiconductor Manufacturing Corporation (GSMC)will start testing 12-inch wafers in April, making GSMC the first foundry in China to produce wafer using 12-inch foundry.
GSMC has already completed the construction of the main building of two 12-inch wafer fabs. The first fab has one section each for 8 and 12-inch production, while the second fab is designed to manufacture 12-inch wafers.
GSMC is with Infineon Technologies and Elpida Memory for 0.11-micron process technology on DRAM manufacturing cooperation.
Once these foundries fully operational, it will have a total capacity of the 100,000 wafers per month. Meanwhile, Infineon Technologies announced the transfer 300mm wafer technology using 0.11-micron processing to Semiconductor Manufacturing International Corp.
The latest technology agreement is an extension of an earlier pact signed last December that transferred Infineon 0.14-micron process technology to SMIC.
SMIC will supply Infineon with DRAM products under a foundry arrangement from both the new 300mm plant and from an existing 200mm fab in Shanghai.
According to Infineon, SMIC is currently building a 12-inch production plant in Beijing and schedule to operate in second quarter of 2004. Analysts believed that Taiwan still the edge and confidence in number 12-inch foundries and advanced process technology five years ahead of China.
By: DocMemory
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