Monday, March 31, 2003
Samsung Electronics announced full production of its four-chip stacked package (MCP) for mobile handsets.
The new MCP can stack four memory chips, SDRAM, SRAM, UtRAM, and NAND/NOR flash, in the package space. Samsung said this reduces the memory chip footprint by 50% for handsets. The MCP is 1.4mm in height.
Samsung also introduced an integrated design software system to help handset developers to cut time in designing MCP, system in package (SIP) and system on a chip products. The new software allows simultaneous design of semiconductor circuits and packages, the company said.
By: DocMemory
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