Friday, April 4, 2003
JEDEC is planning to setting up a chip and module validation program with its own seal to ensure memory devices meet the full industry standard specifications, according to EBN.
A task group has been formed to work out the detail under the leadership of Desi Rhoden, chairman of JEDEC. The plan includes using a third party independent laboratory to do the certification. Desi said "Creating logo branding and certification will bring a level of assurance not previously available to the OEM and end user," EBN reported.
"Some module suppliers are cutting corners in making product that they then sell at a large discount. But the device outside JEDEC specifications may cause system failures. The consumer currently doesn''t have any reasonable tool to determine product compliance with specification," Desi added and claimed this is a way to ensure the memory module makers play by the rules.
Arthur Sainio, senior strategic marketing manager at Smart Modular Technologies, Fremont, Calif., however pondered whether the JEDEC effort would duplicate existing device testing by OEMs and processor makers. Rhoden denied the claim by saying that JEDEC's effort would be supplemental rather than competing with the existing validation programs. Furthermore, Desi said JEDEC's effort would serve and support the vast market and all the parts instead of a selected few, EBN reported.
As far as the cost issue, Rhoden said it is still under study. Accordingly to EBN, an analyst said most DRAM and modules makers are financially stressed now and may not want to absorb any additional expenses including JEDEC certification, if any.
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