Tuesday, July 1, 2003
Powerchip Semiconductor (PSC) said the company will spend close to US$2.0 billion to build a new 12-inch wafer fab before the end of 2003. PSC's chairman, Frank Huang said the second 12-inch wafer fab would help the company to increase the DRAM production that would increase global market share by 20 percent more to its present share.
Construction would start in November, with the equipment scheduled to arrive in early 2005 and mass production to start in the Q2 2005. There was no discussion of where the funding for a second fab would come from but PSC has a strategic alliance with Elpida Memory Inc., a joint venture between NEC and Hitachi that is assimilating Mitsubishi's DRAM division.
Presently, PSC has one 12-inch plant and one 8-inch plant in Taiwan. At the first 12-inch fab, production cost for 256Mbit DDR 400 DRAM is expected to fall to less than US$3 as the company ramps up production in Q4. PSC will adopt Mitsubishi Electric'’s 0.11-micron process along with Elpida Memory's 0.10-micron process in the fourth quarter of this year. Huang expecting the production capacity would grow 70% this year.
By: DocMemory
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