Infineon Technologies has joint venture with China-Singapore Suzhou Industrial Park Venture Co. (CSVC) in China for memory assembly and testing. Infineon said it will invest $241 million in the venture over the next five years.

The facility will be constructed in the Suzhou Industrial Park (SIP), 80km to the west of Shanghai, with maximum capacity of up to 1 billion chips a year, source said. 

“With this partnership we are systematically expanding our presence in the future market of China, we will gain access to new customers, and aim to capture a 40 percent share of the market for memory products in China,” said Infineon’s President and CEO Ulrich Schumacher.

By: DocMemory
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