After the acquisition, IPAC will become a new and independent company that will provide IC-packaging and related services including semiconductor package design, engineering, assembly, and test in prototype. Initially, the company will offer the BGA and QFP formats, expanding later into wafer-level packaging, the company said.

"I believe the timing is ideal for the re-establishment of an advanced semiconductor packaging foundry to serve Silicon Valley and the domestic market," said Batinovich, who is president and CEO of the new company. "Since we are either a short drive or within a few air hours of every important U.S.-based semiconductor manufacturer, we will be able to provide critical services that companies would otherwise have to obtain offshore in Asia," he said.

In April, OSE in Taiwan announced plans to shut down its U.S. manufacturing facilities in San Jose. Following those event, Batinovich led a group to purchase the entire facility. 

By: DocMemory
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