Monday, August 25, 2003
Hynix Semiconductor Inc said it has developed a new DDR2 DRAM that implements 0.11-micron process technology.
Company officials said that the new chip processes data at twice the speed of existing DDR products, offers low electricity consumption, and can be used in the main memory of PCs and workstations.
Hynix will begin sampling its 1Gb DDR2 early in the fourth quarter of 2003, and will begin full-scale volume production by early 2004 to coincide with the release of Intel's DDR2 chipset.
The 1Gb and 512Mb DDR2 will be offered in 68-Ball, and 60/84-Ball Fine-Pitch Ball Grid Array (FBGA) packages.
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