Tuesday, August 26, 2003
Elpida Memory Inc. said itwould transfer its 0.11-, 0.10- and 0.09-micron technology to its Taiwanese DRAM manufacturing partner, Powerchip Semiconductor Corp.
Powerchip will implement Elpida's 0.10-micron and 90-nm process technologies within its 300-mm fab. Initial production of 0.10-micron devices is due in April of 2004 and mass production scheduled in October of 2004. The 90-nm technology process is scheduled to commence in early 2005.
Powerchip is also entitled to develop, produce and sell its own products manufactured by Elpida's updated process technologies for 256-Mb and 512-megabit products and even 1-gigabit products.
Brian Shieh, president of Powerchip, indicated that the total capacity of the 300-mm fab is 15,000 wafers per month, applying 0.13- micron process technology for volume production.
The technology transfer agreement will follow the same cooperation between Powerchip and Mitsubishi Electric Corp. For years, Powerchip has made DRAMs on a foundry basis for Mitsubishi. Powerchip has also been making DRAMs for Tokyo-based Elpida.
By: DocMemory
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