United Microelectronics Corporation (UMC) projects 12-inch wafer output using 0.13-micron processing in the fourth quarter to exceed 10,000 units up from the current 4,000 level, said sources.

Sources said UMC’s major clients including TI, ATI, Xilinx etc accounted for 50% of that figure.

Compared to 8-inch wafers, using 0.13-micron processing on 12-inch wafers can produce more than twice the number of chips. Therefore, companies have been aggressively migrating to 12-inch wafers despite 12-inch wafer prices remaining high, at over US$4,000, analysts said.

By: DocMemory
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