Infineons TSOP packaged components based on the 110-nm fabrication process are all set to be both lead-free and halogen-free, Infineon said. This includes 256-Mbit, 512-Mbit and 1-Gbit DDR chips in TSOP and special memories such as GraphicsRAM, MobileRAM, and CellularRAM. The company didn't update such environmental friendly packaging on its flash memory and logic chips.

Unbuffered DRAM memory modules based on the "green" 256-Mbit DDR TSOP components are available now, and other components will be available later in 2003, Infineon said.

Green means the components have extremely low lead and halogen content. Conventionally lead is found in pins, solder balls and solder paste, while halogen substances are used for printed circuit board assembly and component molding compounds, accordingly to a news source. 

The European Union directive on Waste of Electrical and Electronic Equipment (WEEE) has already been passed into law and requires products sold within the EU countries to be recycled, beginning in January 2007. In addition, the second European Union directive on Restriction of Hazardous Substance (ROHS) which also bans the use of lead and certain other hazardous materials beginning in July 2006. 

By: DocMemory
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