ST Assembly Services Ltd. (STATS) introduced a new die stacking technology in its package offerings. The Singapore based semiconductor test and packaging service provider said different combinations of stacking are available because stacking technique allows the upper die to be equal or larger than the lower die in the package.

Two or multiple ICs can be stacked within a single package to improve performance while reducing size and cost, the company said.

STATS expects to use the die stacking technology not only for memory applications, but also to integrate mixed-signal logic and memory devices for wireless applications.

By: DocMemory
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