Toshiba fabricated a test chip based on five-metal-layer, 90-nm process technology using the X Architecture. This technology takes a different approach in chip interconnect, by using diagonal pathways and the traditional right-angle or "Manhattan" configuration.

Compared to a Manhattan version of the same design, the X Architecture implementation required 14 percent less total wire length and 27 percent fewer vias, according to Toshiba. Takashi Yoshimori, technology executive at Toshiba, said the company plans to move the chip technology into production in 2004.

The focus of the X Initiative is shifting towards broad adoption of the X Architecture for production manufacturing at both current and future manufacturing nodes. The X Initiative, a group of leading companies from throughout the semiconductor industry, is chartered with accelerating the availability and fabrication of devices based on the X Architecture.

By: DocMemory
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