The agreement is expected to accelerate Honeywell's ability to develop radiation-hardened MRAMs for military and aerospace applications, such as satellites. Honeywell and Motorola collaborated with the Defense Advanced Research Project Agency in the initial research and development of MRAM.

Honeywell of Minneapolis plans to incorporate Motorola's MRAM memory elements with its radiation-hardened, silicon-on-insulator (SOI) technology. It hopes to develop a memory chip capable of providing data stability in the harsh operating environments of space, including for satellite and military applications.

"Combining Motorola's MRAM with Honeywell's silicon-on-insulator radiation hardened process will produce a new, revolutionary chip that improves data storage," said Eric Doremus, vice president of Honeywell's precision sensors and components business, in a statement.