Rambus Inc. at Microprocessor Forum today announced its roadmap to bring XDR DRAM to the PC main memory market by 2006.

The next-generation memory interface, previously known as Yellowstone, can scale at 6.4GHz and beyond and runs at 3.2GHz, eight times the bandwidth of today's best-in-class PC memory, according to Rambus.

"Today's PC main memory systems are performance limited due to their use of single-ended signals and multi-drop data busses," said Laura Stark, VP of the memory interface division at Rambus, in a statement. "Differential signaling and Rambus' novel Dynamic Point-to-Point module upgrade technology allow users to maximize capacity in their memory systems without compromising performance."

Rambus further said that it has defined all necessary steps to bring XDR to PC main memory, including a broad range of XDIMM memory modules, programmable-width XDR DRAMs, buffers, connectors, clock generators, and system design guidelines and documentation.

The XDIMM memory module will provide 12.8Gbytes/sec. to 25.6Gbytes/sec. of bandwidth, four times more memory module bandwidth in the same pin count and form factor as DDR2 DIMMs, Rambus boasted. XDR offers a roadmap to 6.4GHz and can scale to interface widths of up to 128-bits, enabling memory system bandwidths up to 100Gbytes/sec., 16 times more than today's 6.4Gbytes/sec. memory systems, the company added.

XDR DRAMs will be available in multiple speed bins, device densities and device widths. Samsung, Elpida, and Toshiba are all licensees of the technology.

By: DocMemory
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