The semiconductor equipment book-to-bill ratio reached 1.02 in September 2003, up from the revised 0.94 figure in August, according to VLSI Research. Worldwide bookings amounted to $3.473 billion in September, while billings were at $3.392 billion.

Of the billings, $1.812 billion were for wafer processing equipment, $863 million for test and related equipment, $256 million for assembly and $461 million for service and spares, the report said.

In contrast to equipment, IC orders show a completely different picture, as the semiconductor book-to-bill hit 1.11 in September, up from 1.08 in August, according to VLSI Research.

Orders have risen steadily all year. In September, the three-month worldwide bookings average hit $13.6 billion. The overall front-end capacity utilization rate broke the 90- percent mark in September and was close to the 95-percent level for 130 nm and below, according to VLSI Research.

By: DocMemory
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