ChipPac delivered what it claims the first six stacked-die CSP in a 1.6mm profile. The multi-stacked package has the dimension of 17x17mm with >400 leads houses a DSP or an applications ASIC chip, along with flash and SDRAM chips for compact footprint, the company said.

The company said research data shows that 100 percent of cell phones in 2004 will ship with stacked-die packages, up from an estimated 60 percent in 2003. Total number of handset shipment for 2004 is projected to reach 480 millions compared to 440 millions in 2003, the company said.  

Functional integration for the six stacked-die CSPs includes a high pin count DSP for the base band or ASIC for the applications. The memory stack includes two flash chips and SDRAM.

The company estimates that it has a 65 percent market share for three or more stacked-die packages that shipped in approximately 10 percent of cell phones in 2003.

By: DocMemory
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